MediaTek Dimensity 9400 Unveiled: A Major Advancement in AI and Gaming Performance

MediaTek has unveiled its latest flagship chipset, the Dimensity 9400, designed to deliver exceptional performance and efficiency tailored for next-gen smartphones. This advanced component represents a substantial leap from the Dimensity 9300, showcasing enhanced CPU capabilities, bolstered AI functionalities, and superior gaming attributes.

Enhanced CPU Design and Efficiency

The Dimensity 9400, a marvel of MediaTek's innovation, is equipped with the second iteration of their All Big Core architecture. At the heart of this sophisticated design lies a high-speed Arm Cortex-X925 core, operating at an impressive frequency of over 3.62GHz, flanked by three equally capable Cortex-X4 cores and four Cortex-A720 cores. This robust configuration ensures that the single-core performance is a staggering 35% swifter, while the multi-core performance is bolstered by an equally remarkable 28%, outpacing its predecessor, the Dimensity 9300. Moreover, the chip is fabricated using TSMC's cutting-edge second-generation 3-nanometer process, which imparts it with a power efficiency that is up to a noteworthy 40% greater, significantly prolonging battery lifespan for an unparalleled user experience.

Improved AI Capabilities

A key highlight of the Dimensity 9400 is its 8th Generation NPU, which brings several industry-first advancements in generative AI performance. It is the first mobile chipset to enable on-device LoRA training and high-quality video generation. MediaTek’s new Dimensity Agentic AI Engine (DAE) enhances conventional AI applications into advanced agentic AI solutions, delivering up to 80% faster prompt performance for large language models (LLMs) while achieving up to 35% greater power efficiency.

Outstanding Gaming Performance

The Dimensity 9400 offers an immersive gaming experience powered by its 12-core Arm Immortalis-G925 GPU, which delivers up to 40% faster ray tracing performance compared to its predecessor. It supports opacity micromaps (OMM) for realistic visual effects and provides a 41% increase in peak performance while saving up to 44% on power. Moreover, the HyperEngine technology, developed in collaboration with Arm, enhances super resolution and delivers exceptional picture quality.

Enhanced Camera and Multimedia Capabilities

The Dimensity 9400 features the MediaTek Imagiq 1090, allowing for HDR video recording across the entire zoom range. Its Smooth Zoom technology facilitates the seamless capture of moving subjects while reducing power consumption by up to 14% during 4K60 video recording. Additionally, it supports a maximum camera sensor resolution of 320MP and can capture video at 8K60.

Connectivity and Extra Features

The chipset is equipped with a state-of-the-art 3GPP Release-17 5G modem that boasts 4CC-CA capabilities, delivering outstanding sub-6GHz performance at a maximum speed of 7Gbps. Furthermore, it integrates an advanced 4nm Wi-Fi/Bluetooth combo chip, which is capable of achieving data transfer rates of up to 7.3Gbps and is compatible with Wi-Fi 7's tri-band MLO technology. Enhancing connectivity, the MediaTek Xtra Range™ 3.0 feature extends Wi-Fi coverage to an impressive 30 meters. This innovative chipset also supports dual-SIM functionality, allowing for concurrent 5G and 4G connectivity. It is specifically designed to accommodate tri-fold smartphones, thus empowering manufacturers to explore and implement unique and cutting-edge design concepts.

Availability 

Smartphones featuring the MediaTek Dimensity 9400 are set to launch in Q4 2024. The Vivo X200, X200 Pro, and X200 Pro Mini, which will debut on October 14 in China, will be the first devices equipped with the Dimensity 9400. Additionally, the Find X8 series, expected to be revealed on October 24 in China, will also include the D9400 chip.